INTRODUCTION TO MICRO AND SMART SYSTEMS: a) What are smart-material systems? Evolution of smart materials, structures
and systems. Components of a smart system. Application areas. Commercial
products.
b) What are microsystems? Feynman’s vision. Micromachined transducers.
Evolution of micro-manufacturing. Multi-disciplinary aspects. Applications
areas. Commercial products.
UNIT – II
MICRO AND SMART DEVICES AND SYSTEMS: PRINCIPLES AND
MATERIALS:
a) Definitions and salient features of sensors, actuators, and systems.
b) Sensors: silicon capacitive accelerometer, piezo-resistive pressure sensor,
blood analyzer, conductometric gas sensor, fiber-optic gyroscope and
surface-acoustic-wave based wireless strain sensor.
c) Actuators: silicon micro-mirror arrays, piezo-electric based inkjet printhead,
electrostatic comb-drive and micromotor, magnetic micro relay, shapememory-
alloy based actuator, electro-thermal actuator.
d) Systems: micro gas turbine, portable clinical analyzer, active noise control
in a helicopter cabin.
UNIT – III
MICROMANUFACTURING AND MATERIAL PROCESSING:
a. Silicon wafer processing, lithography, thin-film deposition, etching (wet
and dry), wafer-bonding, and metallization.
b. Silicon micromachining: surface, bulk, moulding, bonding based process
flows.
c. Thick-film processing:
d. Smart material processing:
e. Processing of other materials: ceramics, polymers and metals
f. Emerging trends
UNIT – IV
MODELING:
a. Scaling issues.
b. Elastic deformation and stress analysis of beams and plates. Residual
stresses and stress gradients. Thermal loading. Heat transfer issues. Basic
fluids issues.
c. Electrostatics. Coupled electromechanics. Electromagnetic actuation.
Capillary electro-phoresis. Piezoresistive modeling. Piezoelectric
modeling. Magnetostrictive actuators.
PART – B
UNIT – V
COMPUTER-AIDED SIMULATION AND DESIGN: Background to the finite element element method. Coupled-domain
simulations using Matlab. Commercial software.
UNIT – VI
ELECTRONICS, CIRCUITS AND CONTROL: Carrier concentrations, semiconductor diodes, transistors, MOSFET
amplifiers, operational amplifiers. Basic Op-Amp circuits. Charge-measuring
circuits. Examples from microsystems. Transfer function, state-space
modeling, stability, PID controllers, and model order reduction. Examples
from smart systems and micromachined accelerometer or a thermal cycler.
UNIT – VII
INTEGRATION AND PACKAGING OF MICROELECTRO
MECHANICAL SYSTEMS:
Integration of microelectronics and micro devices at wafer and chip levels.
Microelectronic packaging: wire and ball bonding, flip-chip. Lowtemperature-
cofired-ceramic (LTCC) multi-chip-module technology.
Microsystem packaging examples.
UNIT – VIII
CASE STUDIES: BEL pressure sensor, thermal cycler for DNA amplification, and active
vibration control of a beam.
UNIT –IX
Mini-projects and class-demonstrations (not for Examination)
a) CAD lab (coupled field simulation of electrostatic-elastic actuation with
fluid effect)
b) BEL pressure sensor
c) Thermal-cycler for PCR
d) Active control of a cantilever beam
1. Animations of working principles, process flows and processing
techniques, A CD-supplement with Matlab codes, photographs and
movie clips of processing machinery and working devices.
2. Laboratory hardware kits for (i) BEL pressure sensor, (ii)
thermal-cycler and (iii) active control of a cantilever beam.
1. Microsystems Design, S. D. Senturia, 2001, Kluwer Academic
Publishers, Boston, USA. ISBN 0-7923-7246-8.
2. Analysis and Design Principles of MEMS Devices, Minhang Bao,
Elsevier, Amsterdam, The Netherlands, ISBN 0-444-51616-6.
3. Design and Development Methodologies, Smart Material Systems
and MEMS: V. Varadan, K. J. Vinoy, S. Gopalakrishnan, Wiley.
4. MEMS- Nitaigour Premchand Mahalik, TMH 2007